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标题: 【Rambus】芯片设计高峰论坛2022 [查看完整版帖子] [打印本页]

时间: 2022-10-19 22:11

作者: skyyyu66 标题: 【Rambus】芯片设计高峰论坛2022

关于DDR5、HBM3、GDDR6等高速接口技术Rambus公司的最新汇报

附件: DDR5 Memory Enables Next-Generation Servers.pdf (2022-10-19 22:11, 1.16 MB) / 下载次数 7
https://www.txrjy.com/forum.php?mod=attachment&aid=NTUwMjkxfDA0NDY0NmI2fDE3NTQ4MDA1NDN8MHww

附件: High-Speed Interface Solutions for 5G.pdf (2022-10-19 22:11, 1.27 MB) / 下载次数 7
https://www.txrjy.com/forum.php?mod=attachment&aid=NTUwMjkyfDFjZWMzYjk1fDE3NTQ4MDA1NDN8MHww

附件: GDDR6 Memory Enables High-Performance Inferencing.pdf (2022-10-19 22:11, 1.34 MB) / 下载次数 7
https://www.txrjy.com/forum.php?mod=attachment&aid=NTUwMjkzfGQ5YWRlZGU4fDE3NTQ4MDA1NDN8MHww

附件: memory bandwidth for AI races higher with HBM3.pdf (2022-10-19 22:11, 1.5 MB) / 下载次数 8
https://www.txrjy.com/forum.php?mod=attachment&aid=NTUwMjk0fDY0ZTQ1NDY1fDE3NTQ4MDA1NDN8MHww

附件: MIPI Sensor Solutions for Autonomous Driving .pdf (2022-10-19 22:11, 1.33 MB) / 下载次数 7
https://www.txrjy.com/forum.php?mod=attachment&aid=NTUwMjk1fGE3MWVmN2M1fDE3NTQ4MDA1NDN8MHww

时间: 2023-2-14 20:17

作者: chayuli

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