意法爱立信（STE）的结局：被母公司分拆了

hawk007

Ericsson and STMicroelectronics today announced an agreement on the way forward for the joint venture (JV) ST-Ericsson. As communicated by the parent companies in December 2012, both have been working together toward a strategic solution for the JV. After months of intensive joint work, the parent companies have selected the strategic option which maximizes their respective future prospects and growth plans.

The main steps agreed upon to split up the JV are the following:

Ericsson will take on the design, development and sales of the LTE multimode thin modem products, including 2G, 3G and 4G multimode（爱立信接受包括2G/3G/4G的LTE多模调制解调器产品的设计开发和销售部门）
ST will take on the existing ST-Ericsson products, other than LTE multimode thin modems, and related business as well as certain assembly and test facilities（ST接受STE现存的产品）
Starting the close down of the remaining parts of ST-Ericsson（开始关闭STE的余下部分）

The formal transfer of the relevant parts of ST-Ericsson to the parent companies is expected to be completed during the third quarter of 2013, subject to regulatory approvals.（预计将在2013年第三季度内拆分完毕）

After the split up it is proposed that Ericsson will assume approximately 1,800 employees and contractors, with the largest concentrations in Sweden, Germany, India and China.（爱立信将接受1800名员工和合同工（外包？），主要分布地为瑞典，德国，印度和中国）

It is also proposed that ST will assume approximately 950 employees, primarily in France and in Italy, to support ongoing business and new products development within ST.（ST接受余下的950名员工）

Today, it is also announced that Carlo Ferro is appointed President and Chief Executive Officer of ST-Ericsson, effective April 1, 2013. Ferro is currently Chief Operating Officer of ST-Ericsson and succeeds Didier Lamouche who, as previously announced, will pursue opportunities outside the company. Ferro will lead the work in securing both business continuity of ST-Ericsson and effective completion of the transition phase.

Hans Vestberg, President and CEO, Ericsson and Chairman of the Board of Directors, ST-Ericsson said: "I welcome Carlo Ferro as the new President and CEO of ST-Ericsson. Carlo has over twenty years of experience in the semiconductor industry and a strong track record in driving and managing complex transformation projects. He has been a contributor to the solid progress ST-Ericsson has made the past year in terms of strategy execution and significantly lowering the breakeven point."

"Ericsson continues to believe that the thin modems hold a strategic value to the wireless industry. With this move Ericsson will create a highly focused "thin modem only" operation - an area in which both parents have invested significant amounts to establish industry leading technology and Intellectual Property," said Hans Vestberg. "Initial customer contacts give support to the belief that our modems will meet the requirements of the manufacturers in the rapidly growing smartphone and tablet market."

As previously communicated, Ericsson has made provisions of SEK -3.3 b. in 2012 which will cover costs related to the implementation of the strategic option. Once the multimode thin modem business has been fully integrated into Ericsson in Q4 the operation will be reported as a standalone segment. Our current best estimate is that it will generate operating losses of approximately SEK 0.5 b. in Q4, 2013, primarily related to R&D expenses.

The thin modem technology developed within ST-Ericsson has evolved into a unique architecture for low power, highly integrated multimode multi-band modems covering GSM/GPRS/EDGE, TD-SCDMA, HSPA+, LTE (TDD/FDD), LTE-Advanced, the widest array of frequency bands and a feature set that includes Single RF Chip Carrier Aggregation, VoLTE and IMS.

An LTE/HSPA+/3G/2G modem based on this evolved architecture was recently demonstrated at Mobile World Congress in Barcelona and has received its first global operator certification.

新浪科技讯 北京时间3月18日晚间消息，爱立信和意法半导体周一宣布，双方将关闭移动芯片合资公司意法-爱立信(ST-Ericsson)，此举将涉及在全球范围内裁员1600人。

　　意法-爱立信成立于2009年，主要致力于开发移动宽带芯片，但实际表现并不令人满意。在美国市场，意法-爱立信不敌高通。在亚洲市场，意法-爱立信又面临着无生产线芯片设计公司(fabless)的强劲挑战。到目前为止，意法-爱立信累计亏损27亿美元，仅去年就亏损7.49亿美元。

　　合资公司关闭后，爱立信将接手LTE芯片(包括2G、3G和4G多模)设计、研发和销售方面的资产，意法半导体将接手其他所有产品，以及大量的组装和测试工厂。而剩余部分资产将被彻底关闭。

　　具体分拆方案如下：

　　1)爱立信将接手LTE多模超薄调制解调器产品的设计、研发和销售资产，包括包括2G、3G和4G多模产品。

　　2)意法半导体将接手合资公司除LTE多模超薄调制解调器产品以外的其他产品和相关业务，以及部分组装和测试工厂。

　　3)合资公司剩余资产将被彻底关闭。

　　关于裁员问题，双方在声明中称：“此次重组将涉及在全球范围内裁员约1600人，欧洲占500人至700人，其中瑞典占400人至600，德国占50人至80人。”

　　剩余员工将被安排转岗，爱立信将负责接收1800人，主要位于瑞典、德国、印度和中国。而意法半导体将负责接收950人，主要位于法国和意大利。

　　此次重组预计将于今年第三季度完成。意法爱立信首席运营官卡尔洛·费罗(Carlo Ferro)已被任命为公司CEO兼总裁，负责此次重组。费罗将于4月1日正式上任，取代迪迪尔·拉莫切(Didier Lamouche)，后者已与上周宣布辞职。